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Title: matrigel process flow
Description: This note is for matrigel process by MEMS method.
Description: This note is for matrigel process by MEMS method.
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Matrigel Process flow
Created Oct 9 2017
Gui Chen conduct the process
Process
Starting wafers
Wafer cleaning
Photolithography
Steps
4inch (100) with
290nm SiO2
Piranha solution
DI wafer rinse
N2 dry
HMDS treatment
S1813 spin coating
Soft bake
Exposure
Developing
Parameters
Note
Add H2O2 to H2SO4 with ratio
1:1
The temperature of solution
will increase
500rpm 30sec then
3000rpm 30sec
Oven 90C 30min
Improve PR adhesion
The rinse should cover ½ of
the wafer
Measure PR thickness with
Nanospec
Intensity
Developer MF 319 30sec
with shaking the beaker
DI water rinse
N2 dry
Hard bake
Oxide etching
Remove PR
KOH etching
Remove oxide
PDMS mold
Matrigel molding
Oven 120C 30min
BOE ~3min
Etching rate 100nm/min
DI water rinse
N2 dry
Acetone
DI water rinse
N2 dry
45% KOH@80C
DI water rinse
N2 dry
BOE ~3min
DI water rinse
N2 dry
Mix 184 A:B with
ratio 10:1
Vacuum
Peel-off the mold
Cut PDMS with a
knife
Put a droplet of
matrigel on glass
Place down PDMS
mold
Vacuum, wait
overnight
Observe the pattern under
microscope
To improve chemical
resistance
Need to wear protective
equipment
Title: matrigel process flow
Description: This note is for matrigel process by MEMS method.
Description: This note is for matrigel process by MEMS method.